XCV200E-6FG456I
- Product Code: XCV200E-6FG456I
- Availability: In Stock
The Virtex FPGA family delivers high-performance, high-capacity programmable logic solutions. Dramatic increases in silicon efficiency result from optimizing the new architecture for place-and-route efficiency and exploiting an aggressive 5-layer-metal 0.22 μm CMOS process. These advances make Virtex FPGAs powerful and flexible alternatives to mask-programmed gate arrays.
Building on experience gained from previous generations of FPGAs, the Virtex family represents a revolutionary step forward in programmable logic design. Combining a wide variety of programmable system features, a rich hierarchy of fast, flexible interconnect resources, and advanced process technology, the Virtex family delivers a high-speed and high-capacity programmable logic solution that enhances design flexibility while reducing time-to-market.
Refer to the Virtex 2.5V Field Programmable Gate Arrays commercial data sheet for more information on device architecture and timing specifications.Fast, high-density Field Programmable Gate Arrays
- Densities from 50k to 1M system gates
- System performance up to 200 MHz
- 66-MHz PCI Compliant
- Hot-swappable for Compact PCI
• Multi-standard SelectIO™ interfaces
- 16 high-performance interface standards
- Connects directly to ZBTRAM devices
• Built-in clock-management circuitry
- Four dedicated delay-locked loops (DLLs) for advanced clock control
- Four primary low-skew global clock distribution nets, plus 24 secondary local clock nets
• Hierarchical memory system
- LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit Shift Register
- Configurable synchronous dual-ported 4k-bit RAMs
- Fast interfaces to external high-performance RAMs
• Flexible architecture that balances speed and density
- Dedicated carry logic for high-speed arithmetic
- Dedicated multiplier support
- Cascade chain for wide-input functions
- Abundant registers/latches with clock enable, and dual synchronous/asynchronous set and reset
- Internal 3-state bussing
- IEEE 1149.1 boundary-scan logic
- Die-temperature sensor diode
• Supported by FPGA Foundation™ and Alliance
Development Systems
- Complete support for Unified Libraries, Relationally
Placed Macros, and Design Manager
- Wide selection of PC and workstation platforms
• SRAM-based in-system configuration
- Unlimited re-programmability
- Four programming modes
• 0.22 μm 5-layer metal process
• 100% factory tested