Advanced Process Technology

Ula Low On-Resistance

Dynamic dv/dt Rating

175°C Operating Temperature

Fast Switching

Fully Avalanche RatedLead-Free                             

 Fifth Generation HEXFET® Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve exemely low on-resistance per silicon area. This benefit, combined with the fast  witching speed and ruggedized device design that HEXFET Power MOSFETs are well known for, provides the designer with an exemely efficient and reliable device for use in a wide variety of applications. The TO-220 package is universally preferred for all commercial-indusial applications at power dissipation levels to approximately 50 watts. The low thermal resistance and low package cost of the TO-220 conibute to its wide acceptance throughout the indusy. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package. The D2Pak is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0W in a typical surface mount application. The through-hole version (IRF640NL) is available for lowprofile application.