W25Q128FVSIG
- Product Code: W25Q128FVSIG
- Availability: In Stock
The W25Q128FVSIG parts manufactured by WINBOND are available for purchase at Jotrin Electronics website. Here you can find a wide variety of types and values of electronic parts from the world's leading manufacturers. The W25Q128FVSIG components of Jotrin Electronics are carefully chosen, undergo stringent quality control, and are successfully meet all required standards.The production status marked on Jotrin.com is for reference only. If you did not find what you were looking for, you can get more value information by email, such as the W25Q128FVSIG Inventory quantity, preferential price, and manufacturer. We are always happy to hear from you so feel free to contact us.W25Q128FVSIF TR with pin details, that includes SpiFlashR Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Package Case is shown on datasheet note for use in a 8-SOIC (0.209", 5.30mm Width), it has an Operating Temperature range of -40°C ~ 85°C (TA), Interface is designed to work in SPI Serial, as well as the 2.7 V ~ 3.6 V Voltage Supply, the device can also be used as 8-SOIC Supplier Device Package. In addition, the Memory Size is 128M (16M x 8), the device is offered in FLASH - NOR Memory Type, the device has a 104MHz of Speed, and Format Memory is FLASH.
The W25Q128FVSIF is SPIFLASH 128M-BIT 4KB UNIFORM SE, that includes 2.7 V ~ 3.6 V Voltage Supply, they are designed to operate with a 8-SOIC Supplier Device Package, Speed is shown on datasheet note for use in a 104MHz, that offers Series features such as SpiFlashR, Packaging is designed to work in Tube Alternate Packaging, as well as the 8-SOIC (0.209", 5.30mm Width) Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Memory Type is FLASH - NOR, the device is offered in 128M (16M x 8) Memory Size, the device has a SPI Serial of Interface, and Format Memory is FLASH.
W25Q128FVSG with circuit diagram manufactured by WINBOND. The W25Q128FVSG is available in SOP Package, is part of the IC Chips.